MAXSUN Showcases Z890 Series Motherboards at 2024 Intel LOEM Summit

Bangkok, November 5, 2024 – The prestigious Intel LOEM Summit, one of the world’s most influential industry events, opened its doors on November 5 at the Shangri-La Hotel in Bangkok. Running through November 7, the summit has attracted leading partners from across the global PC ecosystem to explore emerging market opportunities and advancements in technology. Among the distinguished participants, MAXSUN was once again invited as a valued Intel partner, taking the opportunity to present its latest innovations, including the much-anticipated Z890 series motherboards.

At MAXSUN’s booth, the Z890 series motherboards drew significant attention from attendees, including senior Intel executives who praised MAXSUN’s achievements and commitment to innovation. The Z890 series represents a milestone in motherboard technology, introducing enhancements in performance, stability, scalability, and user-centric design that cater directly to consumer demands.

The highlight of the showcase, the MS-iCraft Z890 Pacific, captivated numerous international clients. This model features a robust 16+1+1 phase Dr.MOS power architecture, delivering stable and powerful energy support for CPUs, unlocking their full potential. Equipped with four high-speed DDR5 memory slots, the Z890 Pacific boasts remarkable overclocking capabilities, supporting speeds up to 8800MHz. The motherboard’s 8-layer server-grade low-loss PCB and advanced back-drill technology minimize signal loss and enhance integrity, ensuring reliable, high-speed data transmission for an exceptional DDR5 memory experience.

Beyond performance, the Z890 series also excels in enhancing user experience. The iCraft series motherboards incorporate a 3.4-inch Sharp LED display for real-time system monitoring and personalized startup screens, adding an interactive and customizable element for users. Additionally, the new PTM UI BIOS adopts a mobile-inspired design for an intuitive and user-friendly layout.

For enthusiasts of white PC builds, MAXSUN introduced the MS-iCraft Z890 Arctic, featuring a unique aesthetic inspired by polar ice fields. This model showcases a refined titanium ice-crystal pattern with dynamic accents, balanced perfectly with MAXSUN’s signature cooling armor to deliver both functionality and artistry.

The unveiling of the Z890 series at the 2024 Intel LOEM Summit reinforces MAXSUN’s commitment to leading in hardware innovation. MAXSUN’s continuous collaboration with Intel and other industry partners is set to drive further advancements, providing users with increasingly exceptional technology experiences.

MAXSUN remains committed to its core values of quality and innovation, promising to deliver higher-performance products that align with the evolving needs of the global market.